Process of making decorative objects

ABSTRACT

Decorative objects are taught comprising preformed shapes of solid inorganic material having smooth perimeter edges, flexible strips of grooved lead material circumscribing the same, and solder joints. In the method of making the objects, soldering is accomplished at a low temperature without melting or distortion of the flexible lead.

United States Patent UNITED STATES PATENTS 4/1883 La Farge ...l6 l/37Lorch [45] Aug. 1, 1972 PROCESS OF MAKING DECORATIVE 1,534,684 4/1925Chilson ..16l/l8 OBJECTS 1,660,460 2/1928 Weiner ..161/ 19 X [72]Inventor: Marie Lurch 419 w. wentworth, 2,228,352 1/1941 Hopfield..l6l/l96 X west Paul 55118 Primary Examiner-John F. Campbell [22]Filed: June 12, 1970 Assistant Examiner-Victor A. Di Palma [211 App] No57 854 Attorney-Robert C. Baker Related US. Application Data [57]ABSTRACT [62] Division of Ser. No. 683,181, Nov. 15, 1967, Decorativeobjects are taught pp s preformed Pat. No. 3,576,697. shapes of solidinorganic matenal havmg smooth perimeter edges, flexible strips ofgrooved lead materi- 52 us. (:1. ..29/l60.6, 29/471.1,29/472.5, a!eireumseribing the same. and solder j In the 29 477 1 1 19 1 37 methodof making the objects, soldering is accom- 51 1 1m. 01 .3211 43/00, 132313/00 plished at a low temperature without melting or distor- [58] Fieldof Search ..29/160.6, 471.1, 472.5, 477, non of the flexrble lead-29/473.7, 475; 63/18, 20; 161/36, 196, 1397, 8 Claims, 9 Drawing Figures[56] References Cited BEST AVAILABLE COPY PROCESS OF MAKING DECORATIVEOBJECTS This is a division of application Ser. No. 683,181, filed Nov.15, 1967, now US. Pat. No. 3,576,697, issued Apr. 27, 1971. 1

This invention relates to a new mode for artistic endeavor andparticularly to unique arrangements of known materials to providedecorative objects. It also relates to a method of making such objects.

The invention is specifically directed to the art of joining togethersolid inorganic oxide shapes using came material of a particularizedvariety and in; aparticularized manner to create objects, such as threedimensional art objects, without being limited to the shape of a baseobject. The teaching of the invention obviates the hazards associatedwith amateur cutting of solid sheets of glass, and the resultantcreation of sharp edges on larger sections (and also on chips and wastepieces).

Preformed smooth-edged shapes of inorganic oxide, such as ceramic orglass, are of course known. A. popular form for glass shapes has beenthe cylindrical or elliptical or irregularly perimetrical shapes formedby only partially softening glass marbles to cause some flow or slumpingand then quickly cooling the slumped material to a solid state.Resulting shapes are more or less flat on the side and have a bulge ofgradually increasing height on the other, with the central portion ofthe shape being approximately the thickest. Perimeter edges are smoothand they lie in, essentially the same plane. These preformed shapes ofglass have heretofore been employed in decorative pursuits. For example,they have been glued immediately adjacent eachother in a monolayer to anunderlying base object of any desired character (such as a bowl or trayor lamp and the like). Then a liquid material has been squeezed in alattice work between the globules of glass to provide the effect of aleaded lattice about the glass globules. While this approach doesprovide for decorative results, it is an approach which is limited bythe fact that the glass globules must be gluedv to an underlying base;and therefore the object to be created is limited by the character ofthe underlying base object.

Lead strips have heretofore been employed in the decorative field; butthey have been lead strips with an l-l-cross section. They have beenemployed in joining together flat shapes of glass cut from a pane ofglass; and by this technique stained glass windows as well as stainedglass flat figures have been formed. The technique, however, is limitedinasmuch as the glass employed must be cut to the size desired, whichintroduces a safety hazard and a problem of skill in accomplishingcorrect cutting. Also limiting is the, fact that a single lead strip hasinvariably, insofar as is known, been used between cut panes of glass tojoin mating edges of the glass, instead of separate framing of glasspieces as taught herein.

A special feature of the invention is that of employing preformedrelatively smooth-edged shapes of solid inorganic oxide material as thebuilding blocks for three-dimensional effects in artisticaccomplishment. A further advantage of the invention is that ofproviding new articles of manufacture consisting essentially ofpreformed shapes of inorganic oxide with a perimeter frame of speciallead shape thereabout. A still further advantage of the invention is theintroduction of a new structural arrangement and a new joint arrangementfor these lead bordered inorganic oxide shapes. Further advantages ofthis invention will be apparent as this description proceeds.

The invention will further be described by referencein FIG. 1; I

Flg. 3 is across-section of the embodiment of FIG. 1, taken on line 3-3of FIG. 2;

FIG. 4 is a perspective view of a preferred embodiment for the lead cameof the invention;

FIG. 5 is a perspective view of an alternate embodiment for that came;

FIG. 6 is a top plan view of an alternate embodiment of the invention,e.g., in the form of a turtle;

FIG. 7 is a side plan view of the embodiment shown in FIG. 6;

FIG. 8 is a top plan view of a still further embodiment of theinvention, e.g., in the form of a caricature of a bug; and

FIG. 9 is a side plan view of the embodiment shown in FIG. 8. I

Referring to the drawing, the embodiment illustrated in FIGS. 1, 2 and 3will first be described.

Glass globule l0, suitably a stained glass of a deformed marble asaforedescribed, with smooth perimeter edges lying in the same plane,comprises the main body of the figure. About this glass globule 10 is aflexible band, 11 of lead; and this band 11 is formed by wrapping aflexible came having the shape illustrated in FIG. 4 about thesmooth'perimeter edges of the glass globule 10. The groove of the cameis oriented inwardly so that the peripheral edge of the globule 10 isrecessed within the groove. Abutting ends of the wrapped strip of cameare then united by soldering, as will be described. The joint for theabutting ends of the strip of came forming the band 11 is obscured bythe strip of came 12 which forms the nose'of the object in FIG. 1.

Similarly, but smaller (about two-fifths the diameter of the globule 10)glass globules l3 and 14 are used to form the eyes for the object shownin FIGS. 1, 2 and 3. Bands l5 and 16, formed of a flexible strip of cameas in FIG. 4, are oriented about the smooth perimeter edges of globules13 and 14 in the same manner as described for the band 11 about globule10. The abutting ends of the, wrapped strip of came forming band 15 arealso united together by solder, as in joint 17 illustrated in FIG. 1.

Bridging over the top of bands 15 and 16, and tangentially solder-unitedto bands 15 and 16, is crown 18. Crown 18 is suitably formed of a stripof I-I-shaped flexible lead came, although this is discretionary and nota critical feature of the invention. In essence, crown 18 is an arcedsection of came; and it is solder-united to bands I5 and 16 at the twotangential areas of contact with those bands.

None of the solder joints thus far described comprise more than acentimeter of solder material extending in any direction. It ispreferable to employ solder joints of essentially spot-type character.Even solder joint 19, between the crown l8 and the strip of came formingnose 12, is preferably less than one centimeter in every dimension. Thisis easily accomplished inasmuch as the came forming the nose or beak 12is preferably only about a centimeter in width. Of course, where a widerelement 12 is employed, a long bead of solder 19 may be employed, ifdesired. The came forming nose 12 suitably is one of the configurationillustrated in FIG. 4 with the groove underneath and the tip cut to forma point, as illustrated.

It should be noted that the soldering of crown 18 to the contactingportions of the bands and 16 of came about eye elements 13 and 14 ispreferably accomplished on the reverse side of the object; and thissolder joint is illustrated at numeral in FIG. Likewise, likewise,contacting portions of bands 15 and 16 with band 11 are preferablysoldered from the reverse side of the figure, as illustrated at numeral21 in FIG. 3.

As the support for the object in FIG. 1, a strip of came, suitably ofH-shape as illustrated but not necessarily of such shape, is curvedabout the lower onefourth to one-half of the band of came 11 surroundingthe glass shape 10 and then bent rearwardly of the figure and curveddownwardly to form leg pedestals 23 and 24. Pedestals 23 and 24cooperate with the stretch of came 22 and about the lower portion ofband 11 to form three points of a triangular support for the object. Abead of solder 25 joins or units the stretch of came 22 to the bottom ofthe band 11 (see FIG. 3). If desired, leaf elements 26 may besolder-attached to any suitable position along the strip of came 22 forasymmetrical effect.

The came illustrated in FIG. 4 has a flat outer surface portion 27 whichbecomes the outer circumferential surface portion of the came as it ispositioned about glass shapes 10, 13 and 14. Perpendicular to this flatouter surface 27 are flat side or lateral surfaces, illustrated for oneside by numeral 28 in the drawing; and these side or lateral surfacesbecome radial lateral surfaces of the came as it is fitted about theglass shapes aforedescribed. The feature of the came in FIG. 5 whichdistinguishes it from the came in FIG. 4 isits curved or arced outersurface or circumferential surface 29. This curve suitably may extend tothe side surfaces as at numeral 30 in FIG. 5; and alternately, the sideor lateral surfaces may be flat without significant curvature. Thestrips of came illustrated in FIGS. 4 and 5 are both equipped with agroove 31 which preferably has a right angle configuration extending thestrip of the came. In some cases this right angle effect may be roundedto such an extent that the groove in the came is essentially withoutsharp corners and is of the nature of a smooth indentation from one leg32 to the other leg 33 of the came.

The objects in the remaining Figures of the drawing likewise are formedof solid inorganic oxide shapes having essentially smooth perimeteredges lying in the same plane and lead came of the type illustrated,with additional elements being added in FIGS. 8 and 9.

Briefly, the turtle of FIGS. 6 and 7 comprises solid shapes 34 and 35with the flexible lead came of FIG. 4 wrapped thereabout to form bands37 and 38. The meeting ends of the wrapped came is obscured by solderjoint 42, which joins the article consisting of shape 35 and band 38 atan angle of about l-l 65 to the article consisting of shape 34 and band37. Thus an additional'three dimensional feature is created whichcritically resides in the angularity between the body and head of theobject. Further, three-dimensional results are achieved by joining legelements, formed of faceted inorganic shapes 36 and flexible came bands39, to the body (which consists of shape 34 and band 37) by means ofuniting the side or lateral surfaces of the came forming band 37 andbands 39. Thus, the bands 39, formed of the flexible lead cameillustrated in FIG. 4 (or alternately the came illustrated in FIG. 5),with the meeting ends of the wrapped came 39 solder united and obscuredin the figure by the body 34 and 37, are placed with their-upper lateralsurface, in the solder united portion thereof, in contactwith a stretchof the lower lateral surface of band 37, with the shapes 36 laterallydisplaced and projecting away from shape 34. In this position the bands39 are united by solder 40 at their lateral surface to the underlyinglateral surface of band 37. The result is that shapes 36 lie in adifferent and lower plane than shape 34. Faceted shapes 36, althoughpolished to give the facets as illustrated, are provided with arelatively smooth peripheral edge, all the points of which, as in thecase of the globules 34 and 35, lie in essentially the same plane. Tail41,

formed of the flexible came in FIG. 4, is suitably solderunited to band37 as illustrated.

The bug of FIGS. 8 and 9 has a body consisting of globule 43 with band45 of flexible came (as illustrated in FIG. 4), and a head consisting ofglobule 44 held in a similar band 46 of flexible came. These two partsare formed as aforedescn'bed, with the solder-united meeting edges ofthe wrapped came obscured by solder joint 47. Legs 48, suitably of wirehaving a composition analogous to the came are solder-united to theobject at the bead 47 of solder. Antenna 49, also of similar wire, witha bead 50 of solder at their outermost extremity, are held in place by abead 51 of solder at the anterior portion of band 46 which holds thehead element 44.

Allinorganic oxide shapes useful according to the invention haveperimeter edges of essentially smooth character (that is, a perimeteredge which is not a sharp cutting edge such as one gains by breakingglass into smaller pieces). Also, allpoints of the perimeter edge forthese shapes lie in essentially thesame plane. These inorganic shapesmay be either ceramic, cermet or glass or the like. Usually, theycontain at least about 40 or 50 percent silica, with alkali or alkalineearth fluxes, plus coloring matter (e.g., cobalt blue, chrome yellow,etc.). Colored soda-lime-silicate glass shapes are very ideal. Globulesof the character formed by softening and allowing some flow of the glassof colored spherical marbles (e.g., soda-lime-silicate glass) arepreferred; but it is also contemplated that globules which have a bulgeon each side (formed in dies) instead on one side, are useful accordingto the invention. Faceted globules are also useful, provided they arenot equipped with sharp cutting edges. For maximum attainment ofthreedimensional decorative effects, it is essential that the performedshapeshave a non-uniform thickness, with the thickest portion thereofusually being near the center portion approximately equidistant fromthe.

perimeter edges thereof. If desired, shapes may consist ofheat-resistant thermoset resinous material.

Lead came employed in the invention has a longitudinal groove along oneside thereof and is relatively BEST AVAILABLE COPY smooth surfaced onthe exterior portions thereof apart from the noted groove. It may evenbe elliptical or circular in the exterior portions apart from thegroove; but the preferred lead came is of a shape which has right angledsurfaces in over-all cross-section, with a longitudinal groove in oneside. Preferably, each lateral side (see 28 and 30 in drawing) is nowider than one-half or even one-third the width of the surface joiningleg elements 32 and 33. The width of the surface joining leg elements 32and 33 is at least one-fourth cm. wide up to about 1 cm. wide. The mostversatile came is about one-half cm. wide.

The came does not merely consist of lead (that is, it does not merelyconsist of lead with the usual impurities contained in commercial lead).It consists of lead, suitably the commercial variety, with at least 0.03percent by weight up to about 5 or percent or even percent of one ormore of antimony, zinc, silver, copper, tin and the like alloyedtherewith. A preferred form of lead composition for the came is oneconsisting of lead, suitably as commercially available with slightimpurities, plus 0.03 to 1.5 percent by weight antimony, and usually anoptional content (e.g., 0.01 to 5 percent by weight) of zinc, silver,copper or tin or any combination of these. Copper is desirable tointroduce a sheen of luxurious character to the came.

In the step of soldering the lead came, common fluxes are useful such asthe acids and rosins normally employed in soldering. The criticalfeatures of soldering are that the temperature must not approach themelting temperature for the lead came (which may be as low as about 550F. or as high as about 620 F and the soldering materials employed mustreadily flow at a temperature no grater than 500 F. and wet as dictatedby flux treatment without running in an uncontrolled manner. The soldermaterial employed will normally contain a proportion of lead which underall circumstances will never exceed about 60 percent by weight of thesolder, a quantity of tin which may account for as much as 40 percent oreven up to 90 or 95 percent of the solder, an optional but preferredcontent of silver normally not exceeding 5 to 10 percent by weight ofthe solder, an optional preferred content of antimony normally notexceeding 3 to l0 percent by weight of the solder, and finally anoptional content of zinc, copper and a variety of other metals normallynot present more than 5 percent or possibly up to 10 percent by weightof the composition. For effective soldering in the critically smallareas as required without disruption or melting of the came, aneedle-like soldering tool has been found to be the most practical.

An extremely important feature of the invention which has been stressedhereinabove is that of holding globules of inorganic matter andessentially framing them and holding them by means of the single stripof came about the smooth peripheral edges thereof. These elements serveas the building blocks for the artistic objects, permitting entirely newcombinations not possible when employing the particular type of cameandthe panes of glass characteristic of the prior art.

That which is claimed is:

1. A process a making decorative objects comprising preformed shapes ofsolid inorganic oxide material, each having a smooth perimeter edgelying in a single plane, and flexible strips of lead material, saidstrips being characterized by having a single longitudinal groove on oneside thereof and by analyzing to contain at least percent lead byweight, said process comprising:

l. snugly circumscribing each of at least two of said preformed shapesof solid inorganic oxide material with a discrete strip of said leadmaterial in such manner that the smooth perimeter edge of each of saidtwo shapes is recessed within the groove of the strip circumscribing thesame and with the ends of each circumscribing strip essentially inabutting relationship 2. uniting the abutting ends of saidcircumscribing strips by applying solder material to the same, tothereby form a continuous band about each of said two shapes:

3. holding said banded shapes adjacent each other with the band of eachin contact and the inorganic material of each free of contact; and

4. uniting solely the contacting and immediately adjacent portions ofsaid strips by applying soldering material to the same, said solderingmaterial being characterized in all cases by containing no more than 60percent lead by weight and said application of said soldering materialbeing accomplished in all cases at a temperature no higher than 500 F.

2. The process of claim 1 wherein said two shapes are held inessentially the same plane, and the bands of each of said shapes areheld in tangential contact for uniting with said soldering material.

3. The process of claim 1 wherein one of said two shapes is held inplane displaced from the plane of the other and only lateral surfaces ofa tangential portion of each of the circumscribing bands on said shapesare in contact for uniting with said soldering material 4. The processof claim 1 wherein a piece of lead material analyzing to contain atleast 85 percent lead by weight and free of any circumscribed shape ofinorganic material is united to a portion of the circumscribing band ofat least one of said two shapes by soldering material satisfying therequirements for soldering material set forth in claim 1.

5. A process of making decorative objects comprising preformed shapes ofheat-resistant thermoset resinous material, each having a smoothperimeter edge lying in a single plane, and flexible strips of leadmaterial, said strips being characterized by having a singlelongitudinal groove on one side thereof and by analyzing to contain atleast 85 percent lead by weight, said process comprising:

1. snugly circumscribing each of at least two of said preformed shapesof resinous material with a discrete strip of said lead material in suchmanner that the smooth perimeter edge of each of said two shapes isrecessed within the groove of the strip circumscribing the same and withthe ends of each circumscribing strip essentially in abuttingrelationship;

2. uniting the abutting ends of said circumscribing strips by applyingsolder material to the same, to thereby form a continuous band abouteach of said two shapes;

3. holding said banded shapes adjacent each other with the band of eachin contact and the resinous material of each free of contact; and

4. uniting solely the contacting and immediately adjacent portions ofsaid strips by applying soldering material to the same, said solderingmaterial being 1 characterized in all cases by containing no more than60 percent lead by weight and said application of said solderingmaterial being accomplished in all cases at a temperature no higher than500 F.

6. The process of claim 1 wherein said two shapes are held inessentially the same plane, and the bands of each of said shapes areheld in tangential contact for uniting with said soldering material.

7. The process of claim 1 wherein one of said two shapes is held in aplane displaced from the plane of the Patent No. 3,680,190 Dated 1,1.9?2

Inventor Marie E LOI'Ch It is certified that error appears in theabove-identified patent and that said Letters Patent are herebycorrected as shown below:

Column 1, line 26, "less flat on the side" should read less flat on oneside --5 column 3, line 1%, "in FIG." should read in FIG. 3. --5 line15, cancel "likewise, column 4, line 6l, "performed" should readpreformed column 5, line 35, "grater" should read greater column 6, line12, after "relationship" insert a semi-colon line 16, the colon (z)should read semi-colon ---5 line 33, "in plane" should read in a planeSigned and sealed this 19th day of December 1972.

(SEAL) Attest:

EDWARD M.FlETCHER,JB. ROBERT GOlTSCl-IALK Attesting Officer Commissionerof Patents ORM PC40 USCOMM-DC 60376-P69 9 [1.5. GOVERNMENT PRlNTiNGOFFICE: I959 OS66334.

1. A process a making decorative objects comprising preformed shapes ofsolid inorganic oxide material, each having a smooth perimeter edgelying in a single plane, and flexible strips of lead material, saidstrips being characterized by having a single longitudinal groove on oneside thereof and by analyzing to contain at least 85 percent lead byweight, said process comprising:
 1. snugly circumscribing each of atleast two of said preformed shapes of solid inorganic oxide materialwith a discrete strip of said lead material in such manner that thesmooth perimeter edge of each of said two shapes is recessed within thegroove of the strip circumscribing the same and with the ends of eachcircumscribing strip essentially in abutting relationship
 2. uniting theabutting ends of said circumscribing strips by applying solder materialto the same, to thereby form a continuous band about each of said twoshapes:
 3. holding said banded shapes adjacent each other with the bandof each in contact and the inorganic material of each free of contact;and
 4. uniting solely the contacting and immediately adjacent portionsof said strips by applying soldering material to the same, saidsoldering material being characterized in all cases by containing nomore than 60 percent lead by weight and said application of saidsoldering material being accomplished in all cases at a temperature nohigher than 500* F.
 2. uniting the abutting ends of said circumscribingstrips by applying solder material to the same, to thereby form acontinuous band about each of said two shapes:
 2. The process of claim 1wherein said two shapes are held in essentially the same plane, and thebands of each of said shapes are held in tangential contact for unitingwith said soldering material.
 2. uniting the abutting ends of saidcircumscribing strips by applying solder material to the same, tothereby form a continuous band about each of said two shapes;
 3. holdingsaid banded shapes adjacent each other with the band of each in contactand the resinous material of each free of contact; and
 3. The process ofclaim 1 wherein one of said two shapes is held in plane displaced fromthe plane of the other and only lateral surfaces of a tangential portionof each of the circumscribing bands on said shapes are in contact foruniting with said soldering material
 3. holding said banded shapesadjacent each other with the band of each in contact and the inorganicmaterial of each free of contact; and
 4. uniting solely the contactingand immediately adjacent portions of said strips by applying solderingmaterial to the same, said soldering material being characterized in allcases by containing no more than 60 percent lead by weight and saidapplication of said soldering material being accomplished in all casesat a temperature no higher than 500* F.
 4. The process of claim 1wherein a piece of lead material analyzing to contain at least 85percent lead by weight and free of any cIrcumscribed shape of inorganicmaterial is united to a portion of the circumscribing band of at leastone of said two shapes by soldering material satisfying the requirementsfor soldering material set forth in claim
 1. 4. uniting solely thecontacting and immediately adjacent portions of said strips by applyingsoldering material to the same, said soldering material beingcharacterized in all cases by containing no more than 60 percent lead byweight and said application of said soldering material beingaccomplished in all cases at a temperature no higher than 500* F.
 5. Aprocess of making decorative objects comprising preformed shapes ofheat-resistant thermoset resinous material, each having a smoothperimeter edge lying in a single plane, and flexible strips of leadmaterial, said strips being characterized by having a singlelongitudinal groove on one side thereof and by analyzing to contain atleast 85 percent lead by weight, said process comprising:
 6. The processof claim 1 wherein said two shapes are held in essentially the sameplane, and the bands of each of said shapes are held in tangentialcontact for uniting with said soldering material.
 7. The process ofclaim 1 wherein one of said two shapes is held in a plane displaced fromthe plane of the other and only lateral surfaces of a tangential portionof each of the circumscribing bands on said shapes are in contact foruniting with said soldering material.
 8. The process of claim 1 whereina piece of lead material analyzing to contain at least 85 percent leadby weight and free of any circumscribed shape of resinous material isunited to a portion of the circumscribing band of at least one of saidtwo shapes by soldering material satisfying the requirements forsoldering material set forth in claim 5.